铜丝球焊技术研究进展

Research progress in copper wire bonding technology

在微电子器件封装第一级互连技术中,丝球焊技术占据着重要地位.随着封装技术的不断发展以及铜芯片技术的逐步应用,铜丝球焊技术开始部分替代金丝球焊应用在一些分立器件、大功率器件等电子元器件的封装中,并在精密封装领域得到推广和应用.本文主要对近年来铜丝球焊技术的相关研究进行了综述,介绍了铜丝球焊技术的发展现状.

Wire bonding is worldwide considered as the dominant technology in the first level interconnection. With the development of the packaging technology and the introduction of the copper wafer technology, copper wire bonding, as the alternative of gold wire bonding, has been used partially in discrete and high power de- vices＇ packaging and in fine pitch applications. The research development of copper wire bonding technology was reviewed in this paper.