摘要
在综述大功率AlGaN/GaN HFET性能退化实验结果的基础上,研究了器件退化与电流崩塌间的关联。分析了现有各类器件失效模型的优点和不足之处。通过沟道中强电场和热电子分布的研究,完善了热电子触发产生缺陷陷阱的器件退化模型。使用这一模型解释了实验中观察到的各类性能退化现象,指出优化设计异质结构可以有效减弱GaN HFET的性能退化。最后提出减弱器件性能退化的方法和途径。
From analyzing the experiments for performance degradation in A1GaN/GaN HFET, the relationship between degradation and current collapse was investigated. The merits and deficiencies for various degradation mechanisms were analyzed and compared. Through the investigation for electric field and hot electron profile in channel, a degradation mechanism of traps induced by hot electrons at high electric field was perfected. Various performance degradations observed in experiments are explained by using this degradation mechanism, from which a new design to weaken the performance degradation in GaN HFET through optimization of heterostructure is established. At last various means to improve the reliability of GaN HFET were proposed .
出处
《微纳电子技术》
CAS
2007年第11期976-984,1007,共10页
Micronanoelectronic Technology