硅树脂的绝缘性及耐热性

The electrical resistivity and heat resistance of silicone resin

以一甲基硅氧烷低聚物和二甲基硅氧烷低聚物为原料,加入适量的室温固化性能调节剂,在催化剂作用下合成了硅树脂;研究了催化剂种类对硅树脂性能的影响,并研究了耐热性、固化性能与绝缘性能的关系。结果表明:以自制催化剂制得的硅树脂的绝缘性能优于以盐酸为催化剂制得的硅树脂的绝缘性能,且不需中和、洗涤,简化了生产工艺;选用两种聚甲基硅氧烷低聚物制得的硅树脂,既可常温固化,也可加温固化,其耐热性较由甲基烷氧基硅烷单体聚合的硅树脂高;固化完全的硅树脂漆膜在200℃下老化30min后,绝缘电阻可保持在1000MΩ,同时还具有良好的附着性和硬度,且无毒。

The silicone resin was prepared by condensation polymerization of methyltriethoxysilane oligomer and dimethyldiethoxysilane oligomer in the presence of ZSYS as catalyst.The effect of silicone properties using various catalysts and the relation among the thermal stability,electrical resistivity,cure at the normal temperature and the storage time were studied.Results indicated that the silicon resin prepared by these two silicone oligomers could be cured both at room temperature and higher temperatures;their thermal resistance is better than the resin prepared by dimethylchlorosilane monomers.The weight loss of these resins began at 300℃.The weight loss increased at 300～ 500 ℃ ,and the total weight loss was 2.299 %.However,the weight loss of the resin prepared by dimethylchlorosilane monomers began at 250 ℃.the electrical resistivity of the resin film,which fully cured and aged at 200℃ for 30min,could reach 1000MΩ.The non-toxic film also showed good adhesion and hardness.