摘要
采用电子陶瓷工艺制备了一系列钙硼硅玻璃/堇青石陶瓷复合材料,堇青石含量分别为50%,60%,70%和80%(质量分数)。对复合材料进行了X射线衍射分析、扫描电镜(SEM)观察和性能测试。结果表明:复合材料的介电常数和热膨胀系数随陶瓷含量的增加而减小,显微硬度随陶瓷含量的增加而增加。堇青石的加入抑制了钙硼硅玻璃中石英的析出,并生成了新相钙长石,其数量随堇青石和烧结温度的增加而增加,但它没有恶化复合材料的物理性能。所制得的复合材料具有高的相对密度(≥96%)、低的介电常数(~6)、低的介电损耗(0.3%~0.5%)、低的热膨胀系数(4.2×10^-6℃^-1~5.2×10^-6℃^-1)和低的烧结温度(≤950℃),有望用作介电材料和基板材料。
A series of glass/ceramic composites were prepared using electronic ceramics process from CaO-B2O3-SiO2 glass and cordierite ceramic, which contains 30% , 40% , 50% , 60% , 70% (mass fraction) ceramic. The phase and microstructural evolution of the composites were characterized by X-ray diffraction and Scanning electron microscope. The properties of the composites were also measured. The results show the thermal expansion coefficient and dielectric constant decrease and the hardness of the composites increase with increasing ceramic content. The precipitation of quartz in the CaO-B2O3-SiO2 glass during the sintering process is prevented and anorthite crystalline phase occurs. The amount of anorthite phase increases with the increase of cordierite content and firing temperature, which has not a bad effect on the physical property of the composites. The obtained composites exhibit high relative density (≥96%), low dielectric constant (about 6), low dielectric loss (≤0.4%) and low thermal expansion coefficient (4.2×10^-6-5.2×10^-6℃^-1) as well as low-temperature sintering behavior (≤950℃), which could be applicable as dielectric and substrate materials.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2007年第A02期445-448,共4页
Journal of Functional Materials
基金
广西自然科学基金资助项目(0339066).
关键词
玻璃/陶瓷复合材料
烧结
微结构
性能
glass/ceramic composites
firing
microstructure
properties