Mo-15Cu薄板坯液相烧结的致密化行为

Densification behavior of Mo-15Cu sheet compact during liquid phase sintering

对Mo-15Cu封装材料的液相烧结致密化行为进行了初步的探讨与研究。通过对不同烧结制度下合金的密度测量、显微组织观察、化学成分分析，获得了波相烧结Mo-15Cu材料的最佳烧结制度。研究表明，采用液相烧结法制备Mo-15Cu合金薄板时，最佳烧结温度为1350～140012，最佳保温时间为3h，此时的合金致密化程度最好，最高相对密度可达到98．37％。对Mo-15Cu材料波相烧结的致密化过程研究表明，固相烧结阶段对于Mo-15Cu材料的高度致密化（相对密度〉95％）起重要作用。

The densification behavior of Mo-15Cu packaging material was studied in this paper. The optimal sintering system for Mo-15Cu material was achieved by density measuring, microstructure analyzing and chemical composition testing of Mo-15Cu composites sintered in different temperatures and in different hold time. The experimental results indicated that the optimal sintering temperature range of Mo-15Cu material was 1350-1400＂C, while the optimal hold time was about 3h. Under the optimal sintering system, the relative density of sintered Mo-15Cu material can reach 98.37%. In addition, the densification procedure research showed that solid-phase sintering process played a critical role in attaining high-density Mo-15Cu composites（relative density〉 95%）.