摘要
主要叙述了适用封接用Mo-Cu导热导电性能的测定方法,论述了Cu和Ni含量对钼铜合金热电性能的影响:机械活化处理及热处理等因素对钼铜合金热电性能的影响。认为Ni等少量杂质元素的加入,Mo-Cu合金材料的热电性能降低;机械活化处理使Mo-Cu合金的热导和导电性能下降;Cu含量的加入和适当的热处理使Mo-Cu合金的热电性能提高。
the test method of thermal and electric conductivity of Mo-Cu alloy for sealing materials, effect of Cu and Ni contents on the thermal and electric conductivity of Mo-Cu alloy, effect of mechanical alloying and heat treatment on the thermal and electric conductivity of Mo-Cu alloy has been discussed respectively in this paper. The results show that small amount element such as Ni can decrease the electric conductivity of Mo-Cu alloy; the thermal and electric conductivity of Mo-Cu alloy decreased after mechanical activation treatment of composite powders; the thermal and electric conductivity of Mo-Cu alloy increased with elevated Cu content and properly heat treatment.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2007年第A02期505-507,共3页
Journal of Functional Materials
关键词
Mo-Cu
导热系数
电阻率
Mo-Cu
coefficient of thermal conductivity
electric receptivity