摘要
采用磁控溅射工艺以Cu、Ag为靶材在1-3型压电复合材料表面制备电极.研究了两种金属材料的溅射镀膜工艺,系统地分析了溅射功率对金属沉积速率、电极导电性能及附着力的影响.结果表明,两种金属的沉积速率随溅射功率的增加呈线性增加,电极方阻及电阻率均随功率增大而减小,溅射功率为100W时电极的附着力较好.
The Cu and Ag thin films are deposited on 1-3 PZT/epoxy piezoelectric composites by magnetron sputtering. The sputtering parameters, such as sputtering power, deposition rate, conductibility and contact performance of the film have been investigated. Results of the experiment show that the deposition rate of Cu and Ag film increase almost linearly with increasing sputtering power. At the same time, with increasing sputtering power, both the resistance of per square and the resistivity of film decrease. At sputtering Dower of 100W, the thin film has good contact property.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2007年第A02期738-740,共3页
Journal of Functional Materials
基金
国家自然科学基金重点资助项目(60572004).
关键词
磁控溅射
电极
导电性能
附着力
magnetron sputtering
thin film
conductibility
contact property