POSS基有机-无机杂化高分子的制备及低介电性能

Preparation and low dielectric property of POSS-based organic-inorganic hybrid polymer

利用硅氢加成反应技术，以多面低聚倍半硅氧烷T8H8和二（对烯丙氧基苯甲酸）丁二醇酯为单体合成了有机．无机杂化交联聚合物。用FTIR和^29Si NMR等对材料进行了结构表征，结果表明，在聚合物中两种单体以化学键相连，无机与有机相均匀分散，T8H8分子中平均有6.3个Si-H键与C=C双键发生了加成反应，得到了三维网络聚合物。TGA分析结果表明，聚合物具有较高的热稳定性，热分解温度为376℃。Ellipsometer测试结果表明，聚合物薄膜具有较低的介电常数，k值为2．4。薄膜表面经三甲基氯硅烷疏水处理后，k值减小为2．2。

A novel organic-inorganic hybrid network polymer was prepared via hydrosilylative addition reaction of octahydridosilsesquioxanes with diene. The FTIR and 29Si NMR technologies were employed to characterize the structure of the resultant polymer. The results reveal that diene are chemically bound to each other and well-dispersed in the polymeric system. Averagely, 6.3 of the eight Si-H bonds of each POSS have reacted with the C=C bonds of dienes, leading to 3-dimensional network polymers. TGA analysis shows that the hybrid polymer has high thermal stability with a Td of 376℃. The dielectric constant of the polymeric film was determined to be 2.4, and reduced to 2.2 after treated with trimethylchlorosilane.