封接用Mo—Cu复合材料研究

Study on molybdenum-copper composite for electronic sealing

通过扫描电镜及X射线衍射等对Mo-Cu复合粉末的粉末形貌、合金化程度及烧结后合金组织结构进行分析，研究了高能球磨后Mo-Cu复合材料的显微组织及其与陶瓷热膨胀性能匹配的关系。结果表明，采用高能球磨机械合金化和氢气烧结的工艺制备的Mo—Cu复合材料，相对密度在98％以上，在室温～700℃热膨胀系数与陶瓷差值在8％左右。

The powder pattern, mechanical alloying level and metallurgical structure after sintering of Molybdenumcopper composite powder was analyzed by means of SEM and XRD, the microstructure of molybdenum-copper composite prepared by high-energy ball milling processing and matching relationship between molybdenum-copper composite of thermal expansion coefficient was studied, the results shows molybdenum-copper composite prepared by the processing of high-energy ball milling and hydrogen sintering has the relative density above 98% percent, the D-value of thermal expansion coefficient between Mo-Cu composite and ceramic is about 8% in the temperature range from room temperature to 700℃.