SnAgCu系无铅焊锡粉末特性的实验研究

The experimental research on properties of free-lead solder powder of Sn-Ag-Cu system

实验研究了导液管内径对SnAgCu系无铅焊锡雾化粉末有效雾化率及粒度分布的影响。结果表明：在一定雾化条件下，导液管内径为3mm，雾化粉末具有较高的有效雾化率、粒度分布及最佳离散度；随着导液管内径的减小，粉末明显细化，有效雾化率略有增加，但粒度分布变差；随着导液管内径的增大，粉末有效雾化率急剧降低，粒度分布变差。

The influences of inner diameter of delivery tube to effective atomizing efficiency and size distribution for free-lead solder powder of Sn-Ag-Cu system were done by means of experiment. The results show that when inner diameter of delivery tube was 3.0ram, the atomizing powder was better in the effective atomizing efficiency and size distribution and the best dispersed degree in condition of atomization. With the decreasing of internal diameter, the powder is significantly refined, the effective atomization efficiency is a little increasing, but size distribution gets bad. With the increasing of internal diameter, the effective atomization efficiency of powder is significantly decreasing and the size distribution gets bad.