摘要
Hot compressive deformation test of Ti-Al-Cu-Si alloy was performed on Gleeble-3500 hot-Simulator over the range of deformation temperature from 1 000 to 1 300 ℃,strain rate from 0.005 s-1 to 5 s-1,deformation degree from 40% to 70%,and samples of d 8 mm×15 mm were used. Change rules of microstructure were mainly studied. The results show that deformation temperature directly influences the nucleation growth and globurizing of grain,and with the temperature rising,the diameter of grain increases,the grain boundary widens. The effect of deformation degree on microstructure varies with deformation temperature. Equivalent diameter of grains shows a trend of falling before elevation with strain rate increasing and temperature rising.
Hot compressive deformation test of Ti-AI-Cu-Si alloy was performed on Gleeble-3500 hot-Simulator over the range of deformation temperature from 1 000 to 1 300 ℃, strain rate from 0.005 s ^-1 to 5 s^-1, deformation degree from 40% to 70%, and samples of d 8 mm×15 mm were used. Change rules of microstructure were mainly studied. The results show that deformation temperature directly influences the nucleation growth and globurizing of grain, and with the temperature rising, the diameter of grain increases, the grain boundary widens. The effect of deformation degree on microstructure varies with deformation temperature. Equivalent diameter of grains shows a trend of falling before elevation with strain rate increasing and temperature rising.
出处
《中国有色金属学会会刊:英文版》
CSCD
2007年第A01期504-508,共5页
Transactions of Nonferrous Metals Society of China
基金
Project(2005CCA06400) supported by the National Basic Research Program of China
关键词
钛
合金
半固体成型技术
微观结构
Ti 14 titanium
semi-solid deformation
microscopic structure