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Microstructure and properties of p-type (Bi_(0.25)Sb_(0.75))_2Te_3 fabricated by spark plasma sintering

Microstructure and properties of p-type (Bi_(0.25)Sb_(0.75))_2Te_3 fabricated by spark plasma sintering
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摘要 P-type thermoelectric material(Bi0.25Sb0.75)2Te3 was sintered by spark plasma sintering(SPS) process in the temperature range of 320-420 ℃. The microstructures of sintered materials were found to be well aligned,particularly when sintered at lower sintering temperatures. The electrical conductivity of the material became larger as the sintering temperature increased. The Seebeck coefficient showed a general decreasing tendency with an increase in sintering temperature. In terms of the power factor,the optimum sintering temperature was found to be 380 ℃ for a maximum value of around 2.6 mW/K. P-type thermoelectric material (Bi0.25Sb0.75)2Te3 was sintered by spark plasma sintering(SPS) process in the temperature range of 320-420℃. The microstructures of sintered materials were found to be well aligned, particularly when sintered at lower sintering temperatures. The electrical conductivity of the material became larger as the sintering temperature increased. The Seebeck coefficient showed a general decreasing tendency with an increase in sintering temperature. In terms of the power factor, the optimum sintering temperature was found to be 380 ℃ for a maximum value of around 2.6 mW/K.
出处 《中国有色金属学会会刊:英文版》 CSCD 2007年第A02期1010-1013,共4页 Transactions of Nonferrous Metals Society of China
关键词 热电材料 火花等离子体烧结 烧结温度 微观结构 性能 (Bi0.25Sb0.75)2Te3 thermoelectric material spark plasma sintering(SPS) sintering temperature
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参考文献15

  • 1GERALD M, BRIAN S, JEFF approaches to an old problem [J] S. Thermoelectric materials: New Physics Today, 1997(3): 42-47.
  • 2ROWE D M. CRC Handbook of thermoelectrics [M]. Boca Raton: CRC Press, 1995: 597.
  • 3DISALVO F J. Thermoelectric cooling and power generation [J]. Science, 1999, 285: 703-706.
  • 4GAO Min, ZHANG Jing-shao. Thermoelectricity changes and their applications [M]. Beijing: Ordnance Industry Press, 1996: 32.
  • 5YIM W M, ROSI F D. Compound telluride and their alloys for Peltier cooling-A review [J]. Solid State Electronics, 1972, 15: 1121-1140.
  • 6YANAGITANI A, NISHIKAWA S, TANAKA Y, et al. Characteristics of Bi2Te3 compound produced by rapid solidification [C]// MATSUURA K, ed. Proceedings of the 12th International Conference on Thermoelectrics. Japan: Yokohama, 1993: 277-280.
  • 7SOKOLOV O B, SKIPIDAROY S Y, DUVANKOV N I. The variation of the equilibrium of chemical reactions in the process of (Bi2Te3)(Sb2Te3)(Sb2Se3) crystal growth [J], Crystal Growth, 2002, 236: 181-190.
  • 8YANG Jun-you, FAN Xi-an, ZHU Wen, BAO Si-qian, et al. Consolidation and thermoelectric properties of n-type bismuth telluride based materials by mechanical alloy and hot pressing [J]. Alloys and Compounds, 2006, 416: 270-273.
  • 9SU Tai-chao, ZHU Pin-wen, MA Hong-an, REN Guo-zhong, CHEN Li-xue, GUO Wei-li. Electrical transport and high thermoelectric properties of PbTe doped with BiTe prepared by HPHT [J]. Solid State Communication, 2006, 138: 580-583.
  • 10YANG Jun-you, FAN Xi-an, ZHU Wen, BAO Si-qian, et al. Microstructure control and thermoelectric properties improvement to n-type bismuth telluride based materials by hot extrusion [J]. Alloys and Compound, 2007, 429: 156-162.

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