摘要
Sip/1199,Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure,particle volume fraction,particle size,matrix alloy and heat treatment on the electrical properties of composites were discussed,and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy,the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same particle content,the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Particle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results.
Sip/1 199, Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, panicle volume fraction, panicle size, matrix alloy and heat treatment on the electrical properties of composites were discussed, and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy, the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same panicle content, the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Panicle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results.
出处
《中国有色金属学会会刊:英文版》
CSCD
2007年第A02期1034-1038,共5页
Transactions of Nonferrous Metals Society of China
基金
Project (2003AA305110) supported by the Hi-tech Research and Development Program of China
Project (2005AA5CG041) supported by the Key-tech Research and Development Program of Harbin, China
关键词
电子封装
硅铝复合物
微观结构
导电性
Si/Al composite
microstructure
electric conductivity
electronic packaging