期刊文献+

Microstructures and properties of Sn-Ag-Cu lead-free solder alloys containing La 被引量:1

Microstructures and properties of Sn-Ag-Cu lead-free solder alloys containing La
下载PDF
导出
摘要 Trace amounts of La were utilized to improve the melting behaviors,microstructures,tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior of Sn-3.0Ag-0.5Cu alloy according to the differential thermal analysis(DTA) tests. The X-ray diffraction(XRD) patterns show that β-Sn,Ag3Sn and Cu6Sn5 coexist in the as-cast solder alloys and LaSn3 phases emerge when adding 0.4% La. The microstructures modified by La are more uniform and much finer than that of baseline alloy,and the coarse LaSn3 particles with complex dendrites are observed by optical microscopy(OM) and scanning electron microscopy(SEM) when the addition of La is up to 0.4%. The composition of the LaSn3 phases is identified by energy-dispersive spectroscopy(EDS). There are considerable improvements in mechanical properties with 0.05% and 0.1% addition,but degenerations by adding 0.4%La. The Vickers microhardness of β-Sn and eutectic area are both enhanced with the addition of La and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area. Trace amounts of La were utilized to improve the melting behaviors, microstructures, tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior of Sn-3.0Ag-0.5Cu alloy according to the differential thermal analysis (DTA) tests. The X-ray diffraction (XRD) patterns show that β-Sn, Ag3Sn and Cu6Sn5 coexist in the as-cast solder alloys and LaSn3 phases emerge when adding 0.4% La. The microstructures modified by La are more uniform and much finer than that of baseline alloy, and the coarse LaSn3 particles with complex dendrites are observed by optical microscopy (OM) and scanning electron microscopy (SEM) when the addition of La is up to 0.4%. The composition of the LaSn3 phases is identified by energy-dispersive spectroscopy (EDS). There are considerable improvements in mechanical properties with 0.05% and 0.1% addition, but degenerations by adding 0.4%La. The Vickers microhardness of β-Sn and eutectic area are both enhanced with the addition of La and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area.
出处 《中国有色金属学会会刊:英文版》 CSCD 2007年第A02期1043-1048,共6页 Transactions of Nonferrous Metals Society of China
关键词 无铅焊料 锡银铜合金 稀土金属 拉伸性能 lead-flee solder Sn-Ag-Cu alloy rare earth element La tensile properties
  • 相关文献

参考文献3

二级参考文献33

  • 1满华,张柯柯,杨洁,程光辉,黄金亮.微连接用无铅钎料及稀土在钎料中的应用现状[J].河南科技大学学报(自然科学版),2005,26(1):10-13. 被引量:5
  • 2马壮,董世知,赵越超.稀土镧和铬对纯铜铸态性能的影响[J].铸造,2005,54(6):598-599. 被引量:11
  • 3冯端.金属物理学[M].北京:科学出版社,1999..
  • 4[1]Abtew Mulugeta, Selvaduray Guna. Lead-free solders in microelectronics [J]. Materials Science and Engineering R:Reports, 2000, 27: 95.
  • 5[2]Anders I E. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructure stability [J]. Journal of Electronic Materials, 2001, 9(30): 1050.
  • 6[10]《金属焊接国家标准汇编1990》[M]. 北京: 中国标准出版社, 1991. 546.
  • 7[11]Moon K L. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys[J]. Journal of Electronic Materials, 2000, 29(10): 1122.
  • 8WOOD E P, NIMMO K L. In search of new lead-free electronicsolders [J]. Journal of Electronic Materials, 1994, 23(8): 709-713.
  • 9HARRISON M R, VINCENT J H, STEEN H A H. Lead-free reflowsoldering for electronics assembly [J]. Soldering & Surface MountTechnology, 2001, 13(3): 21-38.
  • 10GADAG S, PATRA S. Numerical prediction of mechanical propertiesof Pb-Sn solder alloys containing antimony, bismuth and or silverternary trace elements [J]. Journal of Electronic Materials, 2000,29(12): 1392-1397.

共引文献49

同被引文献15

  • 1王慧,薛松柏,陈文学,王俭辛.不同钎剂对Sn-Zn系无铅钎料润湿特性的影响[J].焊接学报,2009,30(1):5-8. 被引量:13
  • 2田君,郝虎,史耀武,夏志东.SnAgCuEr系稀土无铅钎料的显微组织[J].焊接学报,2006,27(9):31-34. 被引量:7
  • 3Peng Xue,Song-bai Xue,Yi-fu Shen,Hong Zhu,Li–li Gao.Study on properties of Sn–9Zn–Ga solder bearing Nd[J]. Journal of Materials Science: Materials in Electronics . 2012 (6)
  • 4Lili Gao,Songbai Xue,Liang Zhang,Zhong Sheng,Feng Ji,Wei Dai,Sheng-lin Yu,Guang Zeng.Effect of alloying elements on properties and microstructures of SnAgCu solders[J]. Microelectronic Engineering . 2010 (11)
  • 5M.A. Dudek,N. Chawla.Nanoindentation of rare earth–Sn intermetallics in Pb-free solders[J]. Intermetallics . 2010 (5)
  • 6Liang Zhang,Song-bai Xue,Li-li Gao,Zhong Sheng,Guang Zeng,Yan Chen,Sheng-lin Yu.Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging[J]. Journal of Materials Science: Materials in Electronics . 2010 (6)
  • 7Jian-Xin Wang,Song-Bai Xue,Zong-Jie Han,Sheng-Lin Yu,Yan Chen,Yi-Ping Shi,Hui Wang.Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints[J]. Journal of Alloys and Compounds . 2007 (1)
  • 8Yaowu Shi,Jun Tian,Hu Hao,Zhidong Xia,Yongping Lei,Fu Guo.Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder[J]. Journal of Alloys and Compounds . 2007 (1)
  • 9M. A. Dudek,R. S. Sidhu,N. Chawla.Novel rare-earth-containing lead-free solders with enhanced ductility[J]. JOM . 2006 (6)
  • 10D.Q Yu,J Zhao,L Wang.Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements[J]. Journal of Alloys and Compounds . 2004 (1)

引证文献1

二级引证文献9

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部