莫尔条纹三维精细测量方法的研究与应用

3-D Topography Measurement by Moiré Fringe

以微电子基板的三维形貌测量为背景,研究了莫尔条纹精细测量机械量的机理与方法。为微电子基板及其他信息产品(如电视机荫罩)提供非接触、快速和高精度的测量技术。

Using 3-D topography measurement of microelectronics substrate as the background, this paper studied the mechanism and method of accurate measured mechanical quantity through Moiré fringe, which provided a non-contact,high-speed and high-accuracy measuring technique for the microelectronics substrate and for other information products （like shadow mask）.