集成电路塑封自动上料系统的研制

Development of the automatic loader system for plastic package of integrated circuit

为实现集成电路芯片塑封的自动化,设计了自动上料系统。该系统采用多运动同步控制技术实现料片传送、料片排放及料片预热的自动控制;采用大导程滚珠丝杠副和高分辨率伺服系统保证机械手的快速精确定位;采用柔性流道结构,适应不同规格集成电路料片的自动上料;并基于Windows2000开发了专用工控软件。该系统适用于DIP、QFP、SOP、TO等系列集成电路芯片的塑封生产,可显著提高生产效率及产品质量。

In order to realize automation for plastic package of integrated circuit, an automatic loader system was designed. Lead-frame transport, lead-frame placement and lead-frame preheating were controlled by the synchronization control technique of multi-movement. Fast precise positioning of the manipulator was performed by the large-pitch ball screws and the high-resolution servo systems. The flexible runner structure was designed to fit different dimension lead-frames. The special industrial control software was also developed based on windows 2000. The system can be applied to the plastic package for DIP, QFP, SOP and TO series integrated circuits. The production efficiency and the product quality would be improved greatly.