SPS法制备微米烧结铜及其微观组织演变规律

Micron Bulk Copper Prepared by SPS and Its Regularity of Microstructure Evolution

采用放电等离子烧结技术(SPS)在750℃和60 MPa的工艺条件下烧结6min,制备出了相对密度大于98.5%、平均晶粒度小于3μm的烧结铜。根据烧结曲线变化特点和特征微观组织,将微米烧结铜的SPS烧结过程划分为4个阶段,即颗粒净化与活化阶段、颗粒接触与烧结颈长大阶段、快速致密化阶段和塑性变形最终致密化阶段,并在此基础上解释了超细粉体的SPS烧结机理。

Bulk copper with relative density above 98.5% and the average grain size less than 3 μm was prepared by spark plasma sintering （SPS） at 750 ℃ and 60 MPa for 6 min. According to the changes of sintering curves and characteristic microstructure, the sintering process of micron bulk copper has four sintering stages, i.e. the stage of cleaning and activating of particles, the stage of particles connection and sintered neck growth, the rapid densification stage, and the final densification stage for plastic deformation. Based on different sintering stages, the sintering mechanism of the super-powder was explained.