集成电路芯片安全隐患检测技术

Test Technology for Hidden Security Troubles in IC

现代信息产业的基础是集成电路,集成电路的安全性决定了信息产业的安全,在集成电路芯片设计过程中考虑不周全或恶意植入不受使用方控制的程序或电路,是对现代信息产业安全的重大挑战。通过对集成电路芯片中安全漏洞的分析,提出了三种检测芯片安全隐患的方法:物理检测、电学检测和协议检测,认为采用物理检测和电学检测相结合的方式可以比较有效地检测出芯片的安全隐患,并对基于电流变化的电学检测技术进行了详细地论述。

IC is the basis of modem information industry, and the security of information industry depends on the security of IC. The lacks of consideration or uncontrollable bad ware put in the design are the big challenges for the security of information industry. By analyzing the security leaks of the IC chips, three methods of hidden security troubles in IC were analyzed and the related test technologies were pointed out： physical test, electronic test and protocol testing. Physical test combing with electronic test inspecting the IC hidden security troubles effectively, and the electrical test technology based on the current was discussed.