摘要
以正硅酸乙酯、硝酸钙、硼酸为原料,用溶胶-凝胶(Sol—Gel)法制备了CaO-B2O3-SiO2微晶玻璃材料,研究了水硅比对凝胶时间的影响。利用热重-差热(TG-DSC),X-射线衍射(XRD)及扫描电子显微镜(SEM)测试手段表征材料的烧结性能、微观结构。测试表明,该材料具有良好的介电性能(介电常数εr=5.112,介电损耗tan δ=1.0×10^-3,1MHz),微观结构由大量的CaSiO3(硅灰石),CaB2O4,SiO2微晶和玻璃相组成,晶相被玻璃相包裹着,外加少量的气孔,晶粒大小为100-200nm,该材料适用于高频电子元器件等领域。
This paper describes the preparation of CaOB2 O3-SIO2 glass-ceramics by Sol-Gel method, using tetraethoxysilane(TEOS), calcium nitrate [Ca(NO3 )2 · 4H2O] and boric acid (H3BO3) as raw material. The effect of H2O/Si on gelling time were studied. TG-DSC,XRD,SEM were used to characterize the sintering performance and microstructure of the material. The dielectric constant is 5. 112 and dielectric loss is 1.0×10^-3 at the frequency of 1 MHz. The main crystalline phases in the samples are most CaO. SiO2 (CS), some CaO · B2O3 (CB) and some SiO2. The grain size of the sintered samples is ranging from 100 nm to 200 nm , with some residual glass phases and pores. It is suggested that the glass ceramics would be a promising material for high frequency integrated circuits and electronic components.
出处
《压电与声光》
CSCD
北大核心
2007年第6期697-699,703,共4页
Piezoelectrics & Acoustooptics