摘要
从导电性角度研究了高强度定向凝固Cu—0．8wt％Cr合金的微观组织形态。结果表明；当凝固界面前沿液相中的温度梯度GL=60℃／cm，生长速度V=30μp／s，导电相α（Cu）晶体分校最少；当GL＝30℃／cm时，α枝晶一次问距λ1随V的增大而增大；当GL＝60℃／cm时，α枝晶沿生长方向的长度随V的增大而增大。这些均利于材料导电性的提高。
On the electrical conductivity, the crystal morphologies of directionally-solidified Cu-Cr alloy were studied. The a (Cu) crystal branching is the smallest when the temperature gradient was 60℃/cm, and the growth rate was 30μm/s. The dendritic arm spacing (firstarm spacing) is increased with increasing the growth rate while the temperature gradient was30℃/cm, so is the crystal length along the solidifcation direction with the temperature gradientkept at 60℃/cm. These microstructural characteristics above are agreeable to obtain a highconductivity.
出处
《铸造设备研究》
1997年第4期39-41,55,共3页
Research Studies On Foundry Equipment
