摘要
SiGe弛豫缓冲层是高性能Si基光电子与微电子器件集成的理想平台.通过1000℃干法氧化组分均匀的应变Si0.88Ge0.12层,在Si衬底上制备了表面Ge组分大于0.3,弛豫度大于95%,位错密度小于1.2×105cm-2的Ge组分渐变SiGe弛豫缓冲层.通过对不同氧化时间的样品的表征,分析了氧化过程中SiGe应变弛豫的主要机制.
An ultra-low dislocation density of 1.2×10^5cm^-2,95% strain relaxed, compositionally graded SiGe layer formed by dry oxidizing the strained Si0.88Ge0.12 alloy on Si (100) substrates at 1000℃ was prepared. By comparing samples with vari-ous oxidation times,the relaxation mechanisms of the strained SiGe layers during the oxidation processes were analyzed.
基金
国家自然科学基金(批准号:60676027
50672079
60336010)
福建省重点科技项目(批准号:2006H0036)
教育部回国留学人员启动基金资助项目~~
关键词
氧化
锗硅弛豫缓冲层
位错
oxidation
SiGe buffer layer
dislocation