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干法氧化制备SiGe弛豫缓冲层及其表征 被引量:2

Preparation and Characterization of a SiGe Buffer Layer by Dry Oxidation
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摘要 SiGe弛豫缓冲层是高性能Si基光电子与微电子器件集成的理想平台.通过1000℃干法氧化组分均匀的应变Si0.88Ge0.12层,在Si衬底上制备了表面Ge组分大于0.3,弛豫度大于95%,位错密度小于1.2×105cm-2的Ge组分渐变SiGe弛豫缓冲层.通过对不同氧化时间的样品的表征,分析了氧化过程中SiGe应变弛豫的主要机制. An ultra-low dislocation density of 1.2×10^5cm^-2,95% strain relaxed, compositionally graded SiGe layer formed by dry oxidizing the strained Si0.88Ge0.12 alloy on Si (100) substrates at 1000℃ was prepared. By comparing samples with vari-ous oxidation times,the relaxation mechanisms of the strained SiGe layers during the oxidation processes were analyzed.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第12期1937-1940,共4页 半导体学报(英文版)
基金 国家自然科学基金(批准号:60676027 50672079 60336010) 福建省重点科技项目(批准号:2006H0036) 教育部回国留学人员启动基金资助项目~~
关键词 氧化 锗硅弛豫缓冲层 位错 oxidation SiGe buffer layer dislocation
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参考文献12

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同被引文献8

  • 1张苗,狄增峰,刘卫丽,骆苏华,宋志棠,朱剑豪,林成鲁.改进型Ge浓缩技术制备SGOI及其机理[J].Journal of Semiconductors,2006,27(z1):252-256. 被引量:1
  • 2Tezuka T,Sugiyama N,Takagi S. Fabrication of Strained Si on an Ultrathin SiGe-on-Insulator Virtual Substrate with a High-Ge Fraction[J]. Appl. Phys. Lett. , 2001,79(12) : 1798-1800.
  • 3Cai K,Li C,Zhang Yet al, Thermal Annealing Effects on a Compositionally Graded SiGe Layer Fabricated by Oxidizing a Strained SiGe Layer[J]. Applied Surface, Science, 2008,254(17) ; 5363-5366.
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  • 5Zhang Y,Cai K. Strain Relaxation in SiGe Layer During Oxidation[J].Appl. Surf. Sci. ,2009,255(6):3701.
  • 6Zhang Y, Cai K, Li C et al. Strain Relaxation in Ultrathin SGOI Substrates Fabricated by Multistep Ge Condensation Method[J]. J. Electrochem. Soc. ,2009,156(2):H115-H118.
  • 7刘旭焱,刘卫丽,马小波,陈超,宋志棠,林成鲁.Growth of High Quality Strained-Si on Ultra-Thin SiGe-on-Insulator Substrate[J].Chinese Physics Letters,2009,26(11):156-159. 被引量:5
  • 8方春玉,蔡坤煌.氧化SiGe/Si多量子阱制备Si基SiGe弛豫衬底[J].光谱实验室,2009,26(6):1516-1518. 被引量:1

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