摘要
介绍了以整体镀镍和局部镀锡-铋相结合,处理电子部件或整机产品外壳内外表面的工艺方法,以此替代传统的镀金层或镀银层。既增加了盒体外表的装饰性能,又提高了盒体内腔的焊接性能。此项工艺技术已在微波组件、功率放大器等许多电子产品上广泛使用,对其它电子产品也有很好的利用价值和应用前景。
Technology of entire nickel plating and partial tin - bismuth alloy plating applied to the outer shell of electronic products is introduced. This new method can be used effectively to replace the traditional golden or silver coating, improving both the performance of outside decoration and inside solderability of metal packages. So it has been used widely in many kinds of electronic products, such as microwave modules, power amplifiers, etc. And it has showed good promise in many other electronic products .
出处
《电子工艺技术》
2007年第6期327-329,共3页
Electronics Process Technology
关键词
整体镀镍
局部镀锡-铋
外表装饰性
内部可焊性
Entire nickel coating
Partial tin - bismuth alloy coating
Outside decoration
Inside solderability
