摘要
研究了微量稀土La对Sn-3.0Ag-0.5Cu无铅钎料显微组织、力学性能、断口形貌、润湿性能和熔点的影响。结果表明:La的质量分数为0.1%可使钎料合金晶粒细化,并显著提高钎料合金力学性能和润湿性能;添加La的质量分数为0.4%将形成粗大LaSn3初生枝晶相,降低力学性能和润湿性能;微量La使钎料合金的熔点轻微增加。
The effects of La on microstructures, mechanical properties, fractography, wetting property and melting temperature of Sn -3.0Ag -0.5Cu lead -free solder alloy have been investigated. The experimental results indicate that the addition of 0.1% La can refine the microstructures of the solder alloy and significantly improve the mechanical and wetting properties; adding 0.4% La will form coarse LaSn3 phases with dendrite characteristics and has detrimental effects on mechanical and wetting properties; the addition of La will slightly increase the melting temperature of the solder alloy.
出处
《电子工艺技术》
2007年第6期341-344,369,共5页
Electronics Process Technology
关键词
无铅钎料
LA
微观组织
力学性能
润湿性能
熔点
lead - free solder
La
Microstructure
Mechanical property
Wetting property
Melting temperature
