AlN陶瓷基板材料的典型性能及其制备技术

Typical properties and preparation technologies of AlN packaging material

AlN陶瓷是一种新型的基板材料,具有优异的电性能和热性能,被誉为新一代高密度封装的理想基板材料。介绍AlN陶瓷的典型性能和导热机理;讨论AlN粉末的5种合成方法:铝粉直接氮化法、Al2O3碳热还原法、化学气相沉积法、溶胶?凝胶法、自蔓延高温合成法和等离子化学合成法;分析AlN烧结助剂的选择和5种烧结工艺:热压烧结、无压烧结、放电等离子烧结、微波烧结及自蔓延烧结;阐述AlN基板的制备工艺及其影响因素。

AIN is a new packaging material with excellent electrical and thermal mechanical. The typical properties and the heat conduction mechanisms of AIN ceramics were introduced. Five synthesis methods of AIN powder were discussed, namely direct nitrogenation of Al powder, carbothermal reduction of Al2O3, chemical vapor deposition, sol-gel method, self-propagating high-temperature synthesis and plasma chemical synthesis. The choice of AIN sintering additives and five sintering technologies were analysed, namely hot pressing sintering, pressureless sintering, spark plasma sintering, microwave sintering and self-propagating sintering. The preparation processes of AIN substrate and its influencing factors were expounded.