摘要
对漏电失效的塑封三极管,通过显微观察、去除异物前后的电性能对比分析、能谱成分分析等技术手段,揭示了因引线镀层材料采用不当引起银迁移致使器件漏电失效的失效模式及失效机理,并提出了相应的建议措施。
The leakage failure of a plastic encapsulated transistor are studied by microscopic observation, comparisen of electric performances before and after removing the foreign substances and energy spectrum analysis ot composition. The leakage failure mode and failure mechanism of the device due to silver migration caused by improper lead coating materials are discovered. And the related corrective actions are presented.
出处
《电子产品可靠性与环境试验》
2007年第6期11-14,共4页
Electronic Product Reliability and Environmental Testing
关键词
引线镀层
银迁移
漏电
失效
lead coating
silver migration
leakage
failure
