RCC与不同FR-4基板积层结构的Tg考察

Tg Study of Build-up Multilayer Made from RCC and Different FR-4 Laminates

文章采用常规RC(C涂树脂铜箔)与不同型号、不同厚度的FR-4基板一次积层制作了不同组成的积层板结构,并对不同型号、不同厚度的基板及其与RCC积层前后的Tg测试分析,结果表明具有不同Tg水平的基板与该RCC积层之后的总Tg几乎不受RCC的Tg影响,仍然为芯板的Tg。

Build up Multilayer boards have been fabricated by a normal RCC and FR-4 laminates of different model and thickness, the glass transition temperatures （Tg） of which have been measured and studied before and after building up. The results indicated that overall Tg of build up multilayer by core laminate of different Tg level with this RCC was almost unaffected by RCC, remaining Tg of core laminate.