摘要
文章简要介绍了FR-4覆铜板次表面缺陷——气泡的危害性,通过系统分析及实验验证,总结出产生FR-4覆铜板产品次表面气泡的主要原因,并提出改善措施。
The article introduces the disserve of subsurface imperfections voids of the FR-4 CCL, sums up the main reason of producing subsurface imperfections voids of the FR-4 CCL through the systemic analysis and experiment validation, and brings forward some amend measure.
出处
《印制电路信息》
2007年第12期38-41,共4页
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