化学镀Ni-P镀层的生长机理研究

Growth Mechanism of Electroless Ni-P Deposits

通过扫描电镜(SEM)等手段对化学镀Ni-P镀层断面形貌和表面形貌观察分析,研究了化学镀Ni-P镀层在不同配位剂(柠檬酸钠)浓度下的生长情况。结果表明,镀层在低配位剂浓度镀液中生长速度最快,镀层由层状组织组成;在中等配位剂浓度的镀液中镀层生长速度居中,镀层由较厚的层状组织组成;在高配位剂浓度的镀液中镀层生长速度最慢,由柱状组织组成。

The sectional and surface morphology of electroless Ni-P deposits was analyzed by SEM. It was found that the deposition rate was decreased, with increase of concentration of complex a-gent. When the specimen was deposited in a bath containing 2 g/L sodium citrate, the deposition rate was high and the deposit consisted of lamella structure. The deposit consisting of thicker lamella structure was found when sodium citrate was 10 g/L and the deposition rate was moderate. In the bath containing 30 g/L sodium citrate, the deposition rate was low and the deposit consisted of column structure.