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矩形平面直流磁控溅射装置工作区域磁场分析 被引量:4

Magnetic Field in Working Region of Rectangular Planar DC Magnetron Sputtering Apparatus
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摘要 通过分析磁场对磁控溅射过程的影响,总结出了矩形平面直流磁控溅射装置工作区域磁场的设计原则,并给出了两种磁体结构.采用有限元方法对一套装置的磁场进行了计算,磁场计算结果与测量值吻合较好.基于上述分析计算,研究了磁场分布对靶材刻蚀形貌的影响,并进一步提出了具体的磁场改进措施.采用分流条垫补方法可以改进磁场分布,如果磁场水平分量呈马鞍形分布,靶材的利用率可以提高,采用磁极斜面结构对磁场分布的改进意义不大.另外,错开磁体间安装接缝和对永磁体精确充磁能够有效提高工作区域磁场分布的均匀性. Analyzing the influence of the magnetic field on magnetron sputtering process, the principles of the magnetic field design for the working region of the rectangular planar DC magnetron sputtering apparatus are summarized, and two feasible magnet configurations are proposed. The magnetic field distribution of one apparatus is evaluated by finite element method to well coincide with the measurements. Simultaneously, the influence of the magnetic field distribution on the target erosion is investigated, and detailed measures for improving the magnetic field are proposed. The magnetic field is improved by shimming method with the shunt bar, and the horizontal magnetic field component with saddle distribution enables to enhance the target utilization. The inclined pole shoe has little benefit to the magnetic field. In addition, staggering the ioint gap between the magnets and preciseiy magnetizing the permanent magnet facilitate enhancing the uniformity of the magnetic field in the working region.
出处 《西安交通大学学报》 EI CAS CSCD 北大核心 2007年第12期1441-1445,共5页 Journal of Xi'an Jiaotong University
关键词 磁控溅射 永磁 磁场 刻蚀 magnetron sputtering permanent magnet magnetic field erosion
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参考文献13

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二级参考文献8

  • 1[1]Okazawa K,Shidoji E.Prediction of the evolution of the erosion profile in a direct current magnetron discharge[J].Journal of applied physics,1999:86(6):2984-2989.
  • 2[2]Shidoji E,Nemoto M,Nomura T.An anomalous erosion of a rectangular magnetron system[J].J.Vac.Sci.Technol.A,2000,18(6):2858-2863.
  • 3[4]German J R.Magnetron shunt for enhanced performance of sputter targets[J].IBM Technical Disclosure Bulletin,1993,36(11):414-418.
  • 4[5]Musil J.Rectangular magnetron with full target erosion[J].J.Vac.Sci.Technol.A,1999,17(2):555-563.
  • 5[6]Kukla R,B(a)hr M,BeiBwenger S,et al.High rate sputtering of metals and metal oxides with a moving plasma zone[J].Thin Solid Films,1993,228(1-2):51-55.
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  • 8[11]Edval J P Santos.Measuring the magnetic field distribution of a magnetron sputtering target[J].J.Vac.Sci.Technol.A,1999,17(5):3118-3120.

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