印刷电路硝酸型锡铅退除液的研制

Nitric Acid Base Stripping Solution for Sn-Pb Deposit of PCB

本文研制了一种新型锡或锡铅退除液。它以稀酸为基液，辅以促进剂、光亮剂和铜保护剂，具有较长的使用寿命，且对铜的腐蚀速率小（0．14μm／min），退除铅锡量为2m2／L，废水处理简单，且无氟化物带来的环境污染，系目前最为实用的退锡水之一。

Stripping s01uti0n with flu0ride-free containing dilute nitric acid, promoter,brightener alld copper protecter is recommended. The corr0sion rate of copper substrate is Icss than 0.l4lim/min and the stripping 4m0unt 0f Sn-Pb alloy deposit (6lim thickness) is ilbout 2n1'jL during the stripping process.