采用“两级跳间隙镀”电源的无氰碱铜工艺研究

Study on Technology of Noncyanogen Alkaline Copper Plating use the Mains of Two-class Jump and Gap Electroplating

回顾了对无氰碱铜研究历史中的经验教训。在大量试验基础上,提出了一种706无氰碱铜工艺。对配位剂的恰当选择、组合及工艺条件控制,能将临界活化电流密度降得很小,使钢铁件上能在宽JK范围内直接预镀铜而取得良好结合力。用开发的"冲击镀加间隙镀两级跳自动电源",更有利于提高结合力及提高抗阴阳离子杂质影响能力。加入适量硝酸钾能降低液温并提高允许JK,有利于无氰加厚镀铜及复杂管件装饰镀。

This artide looked back to the experience and lessons in studying history about nonhydrogen basic copper, have brought forward one kind of 706 on large amount of experiment basis. Use the development＂impact and gap electroplating two - class jump automatic mains＂is more beneficial to improving the bond and the anti - ying and yang ion foreign substance affects an ability.