摘要
建立手机纸浆模塑包装热压定型模具模型,使用有限元分析软件对其在特定条件下进行了结构分析。讨论了有限元分析中的前置处理及分析结果,对有限元分析云图中出现的局部应力集中、位移量较大的区域进行优化,同时对多余的材料浪费进行外削减。改进后的阴模、阳模结构材料更省、结构更合理,证明有限元分析对结构优化效果明显。
The model of the hot-pressing moulds for mobile telephone PMP packaging was established. The structure of the model was analyzed in specific conditions by FEA software. The pre-processing and the result of FEA were discussed. The local stress concentration and large displacement zone were optimized and the superfluous material was reduced. The optimized moulds'structure is more reasonable and the material is less than before, which proved the optimization is obvious by FEA.
出处
《包装工程》
CAS
CSCD
北大核心
2007年第12期129-131,共3页
Packaging Engineering