LF6/TA2扩散焊接接头组织结构及性能

Structure and performance of LF6/TA2 diffusion bonded joint

进行了LF6/TA2扩散焊接试验,结合断口形貌、XRD分析、能谱分析和接头强度测试,研究了Al,Mg,Ti三组元互扩散过程,给出了接头形成规律及其强度性能。结果表明,扩散焊接可以得到最高抗剪强度达83 MPa的LF6/TA2接头;525℃以上扩散焊接时会发生扩散反应,生成唯一的三元金属间化合物新相Al18Ti2Mg3;接头强度受固溶冶金结合区及扩散反应新相区的影响,随前者增大而增大,随后者增大而减小;Al,Ti元素可以互扩散,但未发现有Mg元素向TA2母材中扩散的迹象;Al,Ti,Mg三元扩散反应产物按照近似线性的生长方式长大。

Structure and performance of the Ti/Al diffusion bonded joint was studied by means of scanning electron microscopy,X-ray diffractometry and shear strength measurement.The results showed that the highest joint strength was 83 MPa.When the bonding temperature reached 525 ℃,the diffusion reaction occurred,and Al18Ti2Mg3 was the unique product from the diffusion reaction.Meanwhile,the joint strength depended on the percentage of solution metallurgical combination area and new phase zone,and it increased with the accretion of solution area but decreased with the accretion of new phase zone.Although interdiffusion of Al and Ti proceeded in the bonding process,Mg did not diffuse to TA2.The results also showed the new phase layer grew in accordance with the linear law.