真实破裂过程分析软件与多物理场耦合软件结构力学模块对比研究

Comparison Study of Realistic Failure Process Analysis Code and COMSOL Multiphysics Code

简要介绍了真实破裂过程分析软件系统(RFPA)和多物理场耦合数值模拟软件系统(COMSOL Mul-tiphysics),并分别运用这两个软件系统对受拉应力作用下带孔平板试件和共心圆轴试件在热应力作用下的受力变形特征进行了数值模拟对比分析,指出真实破裂过程分析软件系统的特色在于对材料破坏过程的分析处理,而多物理场耦合数值模拟软件系统的特色在于对于复杂多场耦合问题的求解,将这两种软件系统各自的特色特点结合起来应用于材料破坏过程中的多场耦合问题分析是以后应当努力发展的方向.

Realistic Failure Process Analysis code （abbreviated as RFPA） and COMSOL Multiphysics code are respectively briefly outlined and comparably employed to study the induced stress distribution of rectangle plate specimen with a hole under tension and a coaxial specimen under temperature loading. Numerical comparisons show that the characteristics of RFPA code lies in the failure process analysis of material and the characteristics of COMSOL Multiphysics code lies in the coupling analysis in complex multiphysical interaction problems. Combination of failure process analysis and multiphysical coupling analysis is an important trend in material failure process fields in tile near future