集成电路光刻过程中的ECO技术

The ECO process in lithography of IC flow

在现阶段深亚微米化的集成电路产业中,设计与制造已经出现日益严重的脱节,生产加工过程带来的重修正问题使得设计-生产周期大大加长,为了克服这个弊端,随之而来的反馈修正技术(ECO技术)应运而生。以光刻过程中光学临近矫正(OPC)技术所涉及到的反向修正技术为例,介绍了几种目前产业界所主要采用(或即将采用)的方法,并为此提出了几个目前所亟待解决的问题。

Within the deep sub-micrometer industry of Integrated Circuit （IC）, the gap between designer and manufacturer is puzzling ahnost everyone. To revise the process from the manufacturing to the designing need quite a long time which is called turn over time, and this time is greatly magnifying the industry risk and increase the cost. Facing the challenge, the engineers bring out a new technique called ECO （engineering change order）. Based on the lithography and OPC （optical proximity correction） technology, some present and future typical methods were introduced, and after careful analysis of these methods, some critical flaws or problems of these methods were pointed out.