大功率白光LED倒装焊方法研究

Flip-chip packaging technology for high-power white light LED

介绍了一种大功率、高亮度LED倒装散热封装技术。采用背面出光的蓝宝石LED芯片,倒装焊接在有静电放电(ESD)保护电路的硅基板上。该封装技术针对传统LED出光效率低下和散热问题做出了改进,有效提高了LED芯片的寿命,降低了制造成本。

A flip-chip packaging technology for high-power and highbrightness LED which has well high heat-con ductance. The I.ED chips reflecting light from backside are soldered onto a silicon substrate with electrostatic dis charge （ESD） control circuit. This packaging improves the luminescence and the radiate-heat capableness of the traditional LED, and it efficiently lengthens I.ED chip＇s life and reduces the cost of manufacture.