覆铜板用低分子量双端羟基聚苯醚树脂

α,ω-Bis(2,6-dimethylhydroxyphenyl)-Poly(2,6-dimethyl-1,4-phenylene oxide) Oligomers Used for Copper Clad Laminate

低分子量α,ω-双(2,6-二甲基羟苯基)聚苯醚(PPO-2OH)具有优异的电性能和耐热性能,改性后的热固性聚苯醚树脂是高性能覆铜板的理想基材之一。介绍了低分子量PPO-2OH的合成方法和热固化改性研究过程,概述了近几年低分子量PPO-2OH针对覆铜板应用的研究进展。

α,ω-bis（2, 6-dimethyl hydroxyphenyl）-poly（2, 6-dimethyl-1, 4-phenylene oxide）oligomers （PPO-2OH） has good electrical property and heat resistance, the modified thermosetting polyphenylene oxide resin can be used as the base materials of high performance copper clad laminate. In this paper, the synthetic method of low molecular weight PPO-2OH and the study process on the thermosetting modification were presented, and the application in copper clad laminate was also described.