光切法测量中三维实体的重建

Rebuilding 3 D Solid in Measurement of the Light Sectioning Method

光切法是一种新型的三维表面轮廓的光电非接触测量方法，它主要有两个步骤：用ＣＣＤ获取物体表面的轮廓信息；重建三维实体。讨论了采用３ＤＡＰＩ实现三维重建的具体方法，并给出了实例。

Light Sectioning Method(LSM) is a new kind of the 3 D surface electric lighted nontouching measurement.There are two main steps:obtaining information of the curve surface of object by CCD;rebuilding the 3 D solid.This paper presents a method to rebuild a 3 D solid using 3DAPI,and an example is given in detail.