摘要
现有的Sn-Ag-Cu无铅焊料其关键问题是熔点比传统的Sn-37Pb高34℃～38℃，使得焊接设备和工艺都必须更换。我们在Sn-20Bi焊料的基础上通过添加微量元素并采用快速凝固的方法研制出一种新型的低熔点焊料。该焊料价格远低于Sn-Ag-Cu，其机械性能、热性能、可焊性以及熔点都接近或优于Sn-37Pb。
The key problem of the current Sn-Ag-Cu lead-free solders is that their melting points are 34℃-38℃ higher than that of the traditional Sn-37Pb, both the soldering equipment and technology process have to be replaced. A novel low welting point solder is fabricated by adding microelements and using a rapid solidification method based on the Sn-20Bi sold- er. The cost of the solder is much lower than that of Sn-Ag-Cu. Its mechanical and thermal properties, solderability and welting point are equivalent or superior to Sn-37Pb.
出处
《计算机工程与科学》
CSCD
2007年第12期140-142,共3页
Computer Engineering & Science
关键词
无铅焊料
低熔点
Sn-Bi-X
偏析
快速凝目
lead-free solder
low welting point
Sn-Bi-X
segregation
rapid solidification
