QFP结构在位移循环下的有限元分析

Finite element analysis of QFP structure subjected to circular displacement loadings

QFP电子封装器件如果发生较大塑性变形,将影响其正常使用。利用有限元分析技术来讨论位移循环载荷作用下影响QFP焊点塑性变形的因素,为控制其变形幅度提供依据。

Circular displacement loadings lead to plastic deformation of QFP package structures. To increase the reliability of QFP package structures, some measures should be taken. In this paper, FEM technique is used to investigate the influences of displacement amplitude and frequency on the plastic strain of QFP package structures. According to the numerical results, some advices are given to reduce the plastic deformation of QFP solders subjected to circular displacement loadings.