Cadence与Ansoft协同仿真信号完整性问题研究

Research on the simulation of signal integrity problems with cadence and ansoft

本文首先介绍了印制板中过孔的一些相关理论以及由它引起的信号完整性问题,接着在Cadence软件中针对过孔布了两段微带线并在时域进行仿真,最后把电路板模型导入的designer和HFSS中,同时对该电路板的表面电流、场强和散射参数矩阵进行了分析,从中可以看出过孔对信号的影响。

this paper presents some relative theories of the via in pcb and the signal integrity problems caused by it firstly, then two microstrips was layout and the simulation in time domain is given, finally, after the pcb model is imported into the HFSS and designer, we analyze the current, field and scared parameter matrix, from which we can get the influence of the via to signal.