摘要
AlSiCp （65 vol.% SiC） electronic packaging materials were manufactured by powder injection molding （PIM） and pressure infiltration process in order to obtain near net-shaped parts. SiCp preformed compacts obtained by pre-sintering process at 1150 K have high strength and good appearance, and the ratio of open porosity to total porosity is nearly 98%. The relative density of composites is bigger than 99%. The thermal conductivity of A1SiCp composites fabricated by this method is 198 W·m^-1·K^-1, and the coefficient of thermal expansion （CTE） is 8.0 × 10^-6/K （298 K）.
AlSiCp （65 vol.% SiC） electronic packaging materials were manufactured by powder injection molding （PIM） and pressure infiltration process in order to obtain near net-shaped parts. SiCp preformed compacts obtained by pre-sintering process at 1150 K have high strength and good appearance, and the ratio of open porosity to total porosity is nearly 98%. The relative density of composites is bigger than 99%. The thermal conductivity of A1SiCp composites fabricated by this method is 198 W·m^-1·K^-1, and the coefficient of thermal expansion （CTE） is 8.0 × 10^-6/K （298 K）.
基金
the National Natural Science Foundation of China (No. 50274014).
