摘要
文中引入一块不同于JEDEC标准测试板的圆形测试板,探究板级跌落碰撞下无铅焊点的可靠性.首先做模态试验了解测试板的动力学特性,接着做跌落测试,同时测量板的应变和加速度历程.并用ABAQUS软件进行模拟,模拟焊点在跌落碰撞条件下焊点的应力应变等.结果表明有限元模拟得到的应变、板中心的加速度响应和试验吻合,而且用模拟预测的失效焊点的位置与试验一致.失效模式是靠近封装一侧的金属间化合物(IMC)界面的脆性断裂.
Different from JEDEC standard test board,a round test board was introduced to do drop test and simulation.Lead-free solder joint reliability under board-level drop impact was investigated.Firstiy,modal test was conducted in order to understand dynamic properties of test board.Secondly,strains and acceleration of test board were measured during drop test,and ABAQUS software was used to do drop simulation and model stresses and strains of solder joints under drop impact.Results show that the model established has close values of acceleration response and strain histories as measured in actual drop test,and the failure mode and critical solder ball location predicted by modeling correlate well with testing.The fracture occurs in intermetallic composite（IMC） on the package side.Failure mode is brittle fracture.
出处
《电子学报》
EI
CAS
CSCD
北大核心
2007年第11期2083-2086,共4页
Acta Electronica Sinica
基金
英特尔与高校合作基金
国家杰出青年基金(No.10325209)
关键词
无铅焊点
板级跌落
有限元
金属间化合物
失效
lead-free solder joint
board-level drop
finite element
intermetallic composite
failure
