摘要
以Sn-3.5Ag-0.7Cu焊料为母合金,探讨了微量稀土元素Ce对Sn-Ag-Cu合金的电导率、润湿性以及力学性能的影响.研究表明:添加Ce对焊料的电导率的影响不大,对合金的润湿性和力学性能的影响较大.当w(Ce)=0.05%时,焊料合金的综合性能较好.
The influence of rare earth element Ce on the conductivities, wetting and mechanical properties of Sn-3. SAg-0.7Cu solder has been studied. It shows that the doping of Ce has a little effect on the conductivity, but great effect on the wetting and mechanical properties of the Sn-Ag-Cu alloy. The solder has a superior comprehensive performance with the addition of 0.05,% Ce.
出处
《材料研究与应用》
CAS
2007年第4期295-299,共5页
Materials Research and Application
关键词
无铅焊料
SnAgCu合金
润湿性
稀土元素
表面吸附效应
lead-free solder
Sn-Ag-Cu alloy
wetting property
rare earth element
surface absorption effect
