期刊文献+

基于APDL的瓦楞纸板压痕折叠过程的仿真 被引量:4

Simulation on the Creasing and Folding Process of Corrugated Board Based on APDL
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摘要 基于APDL(ANSYS Parametric Design Language)语言建立了瓦楞纸板仿真模型,运用接触分析及MPC(Mul-tipoint Constraint)技术,在考虑瓦楞纸板材料非线性及几何非线性的基础上,对瓦楞纸板的压痕及折叠过程进行了模拟仿真,得到了瓦楞纸板的变形图、最大应力及应力分布情况,为完善工艺流程提供了理论依据。 The APDL (ANSYS Parametric Design Language) was used in this paper to simulate the creasing and folding process of corrugated board. First a corrugated board model was built up. Then contact analysis and MPC (Multipoint Constraint) technology was used in the course of simulation with considering geometric nonlinear and nonlinear material of corrugated board. At last the results including deformation map of corrugated board, maximum stress and stress distribution map were given, which provide a theoretical basis for improving the process.
出处 《武汉理工大学学报》 EI CAS CSCD 北大核心 2007年第12期133-135,共3页 Journal of Wuhan University of Technology
关键词 瓦楞纸板 APDL 压痕 折叠 非线性分析 corrugated board ANSYS parametric design language creasing folding non-linear analysis
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参考文献2

  • 1Liliana Beldie, Coran Sandberg, Lars Sandberg. Paperboard Packages Exposed to Static Loads-finite Element Modelling and Experiments[J]. Packaging Technology and Science,2001, (14) : 171-178.
  • 2Renman M. A Mechanical Characterization of Creased Zones of Corrugated Board[D]. Lunds: Tekniska Hogskola, 1994.

同被引文献22

  • 1唐万有.模切压痕技术在瓦楞纸箱中的应用[J].中国印刷物资商情,2005(2):34-38. 被引量:3
  • 2韩祥龙,王义燕.纸张模切与压痕工艺的设置及应用[J].印刷技术,2004(32):52-54. 被引量:1
  • 3Isaksson P, Hagglund R. A Mechanical Model of Damage and Delamination in Corrugated Board During Folding [ J ]. Engineering Fracture Mechanics, 2005(72) : 2299-2315.
  • 4Rami H A, Joonho C, Bo-Siou W, et al. Refined Nonlinear Finite Element Models for Corrugated Fiberboards[J]. Compos Street, 2009(87) : 321-333.
  • 5Talbi N, Batti A, Ayad R, et al. An Analytical Homogenization Model for Finite Element Modeling of Corrugated Cardboard [J]. Compos Struct,2008(4) :8-19.
  • 6Henrik B. Simulation of the Conversion Process for Corrugated Board Boxes[ D]. Swenden: Lunds University, 2005.
  • 7Liliana B, Goran S, Lars S. Paperboard Packages Exposed to Static Loads-finite Element Modelling and Experiments[J]. Packaging Technology and Science,2001(14):171-178.
  • 8Thakkar B K, Gooren L G J, Peerlings R H J, et al. Experimental and Numerical Investigation of Creasing in Corrugated Board[J]. Philosophical Magazine,2008(88) :3299-3310.
  • 9Isaksson P, Hagglund R. A Mechanical Model of Damage and Delamination in Corrugated Board During Folding[J ]. Engineering Fracture Mechanics, 2005(72) :2299-2315.
  • 10Rami Haj-ali, Joonho Choi, Bo-Siou Wei, et al. Refined Nonlinear Finite Element Models for Corrugated Fiberboards[J]. Compos Struct, 2009(87) :321-333.

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