摘要
介绍了水冷固态功放组件设计过程中的关键技术,包括快接、水道形式和焊接等。针对某固态组件,建立了不同水道形式下的热分析模型,并进行了仿真计算。以此为基础,从热源温度方面分析了水冷组件内强化传热性能,得到了串连水道利于热耗散的结论。样件实验结果表明文中的分析方法是合理有效的。
This paper introduces some key techniques of liquid cooling for solid-state power amplifier modules, including quick-connectors, flow channel forms and welding methods. Thermal analysis model for a solid-state power amplifier is established and a series of simulations are performed to analysis source temperature. The results show that serpentine flow channel is beneficial to heat dissipation, which is verified by experiments.
出处
《电子机械工程》
2007年第6期24-26,36,共4页
Electro-Mechanical Engineering
关键词
冷板
热分析
热测试
cold plate
thermal analysis
thermal test
