Cu-Mn合金熔体在金属W板上的润湿性

Wettability of liquid Cu-Mn alloy on W substrate

采用高温座滴法测量了温度为1150℃、真空条件下Cu—Mn合金在W板上的接触角，研究了不同Mn含量对Cu—Mn合金与W板间润湿性的影响并阐述其影响机理。结果表明，随着Mn元素含量的增加，Cu—Mn合金与钨板间的接触角不断减小。分别利用EDS和XRD对座滴合金与W基板间的润湿界面进行了分析，发现Mn元素在界面处产生了富集，富集层厚度为1～2μm；Cu—Mn／W界面处没有新反应物生成；Mn元素的存在促进了界面处Cu、Mn和W间的相互扩散；Mn富集层的存在改善了二者之间润湿性，使Cu／W界面结合方式由最初的机械结合转变为冶金结合，有利于提高二者间的界面结合强度。

By sessile drop technique the wetting behaviors of molten Cu-Mn alloys on W substrate have been measured at the temperature 1 150 ℃ under vacuum condition. The effect of different.Mn contents on the wetting of W substrate by molten Cu-Mn alloys was investigated and the mechanism of the influence on wettability was studied as well. The results show that the contact angle is gradually decreased with the increasing content of active Mn element. The wetting interface of Cu-Mn/W was analyzed by EDS and XRD separately. It is found that Mn element are enriched along the interface and the thickness of rich Mn layer is about 1 - 2μm, There is no new reactive phase in the interface. The diffusion alloy layer is formed in the Cu-Mn/W interface where Mn element induces the course of diffusion among three phases of Cu, Mn, and W. The wettability of Cu-Mn alloys on W substrate is improved and the bonding manner of the Cu/W interface is transformed from the initial mechanical bond into the metallurgical bond as the diffusion alloy layer enriched Mn element has been shaped in the Cu/W interface. It is favorable for enhancing the bonding strength of the interface between Cu and W