温度对环氧模塑料性能的影响

The Impact of Temperature on the Performance of Epoxy Molding Compound

环氧模塑料(EMC)作为半导体产业的三大基材之一,其性能对成品器件、IC品质至关重要。凝胶化时间(GT)和螺旋长度(SF)是环氧模塑料的两个基本性能表征指标,直接决定封装工艺参数选择范围,而温度对其影响极大。制备过程、存贮、回温(Thawing)及模压(Molding)等系列工序的操作及环境温度,对EMC的综合性能有着不同程度的影响。不恰当的温度可能会导致模压操作性不良、封装体缺陷及半导体器件(电路)的成品性能下降或失效。文章重点阐述温度对EMC使用、半导体成品性能的影响。

Epoxy molding compound （ EMC ）, one of the largest three kinds of raw materials in semiconductor industry, performs the significant functions on the capabilities of discrete and IC. Gelation time and spiral flow length, the basic performance indexes, directly define the process parameters. However, the temperature affects them greatly. The temperature conditions of these procedures, such as manufacture, storage, thawing and molding etc. engender the different extent of impacts. Unapt temperature selected, may lead to the badness of molding workability, encapsulation body defect, and attenuation or fault of the semiconductors capabilities. This paper emphatically expounds the influences of temperature on the usage of EMC and the capabilities of semiconductors.