摘要
热红外侦察是当前武器装备在战场中面临的重要威胁。本文阐述了热红外伪装的基本原理和手段,介绍了热红外伪装涂料用的颜料和粘合剂的发展现状,指出了现有伪装涂料的不足之处以及改善方法。另外,对热红外伪装的未来发展趋势作了阐述,分析了智能伪装材料和基因伪装材料在对抗热红外侦察上的优越性。
Thermal infrared detection is a very important threatening in the battlefield nowadays. This paper introduces the rationale and means of thermal infrared camouflage, expatiating the development of pigment and bond, pointing out the shortage and improving method of camouflage coating in existence. The paper also introduces the future developing trend of thermal infrared camouflage, analyses the advantage of smart materials and gene materials.
出处
《新技术新工艺》
2007年第12期88-91,共4页
New Technology & New Process
关键词
热红外
发射率
半导体颜料
智能伪装
thermal infrared, emissivity, semiconductor pigment, smart camouflage