聚晶金刚石复合片磨削试验研究

Grinding experimental research of PCD

本文采用金刚石砂轮对聚晶金刚石(PCD)复合片材料进行了精密平面磨削试验,研究了磨削工艺参数和砂轮特性对磨削力的影响规律,分析了磨削PCD材料去除机理。研究发现:随着砂轮速度的增大,切向磨削力和法向磨削力不断减小;随着磨削深度的增加,切向磨削力和法向磨削力都增加,相同粒度的陶瓷结合剂砂轮的磨削力大于树脂结合剂砂轮的磨削力;切向磨削力和法向磨削力都随着工件进给速度的增加而增大;粒度号越大,切向磨削力和法向磨削力越大。PCD材料去除主要是通过磨粒的机械磨耗、破碎作用和热物理、热化学作用等方式。

The precision surface grinding tests on polycrystalline diamond composite （PCD） were conducted by using diamond grinding wheel. The effects of grinding parameters and characters of grinding wheel on grinding force were investigated and the material removal mechanism of grinding PCD was analyzed. It is found that the tangential grinding force and normal grinding force are declining as the wheel speed increasing. Both the tangential grinding force and normal grinding force increase with the depth of grinding. The grinding forces of resin bond wheel are bigger than that of vitrified bond wheel in case of the same grit size. When the workpiece speed increases, the tangential grinding force and normal grinding force both increase. The tangential grinding force and normal grinding force also increase with the grit size. The dominant material removal mechanisms in grinding of PCD are abrasive wear, fragmentation, thermal- physics and thermal- chemical process.